New silicone optical bonding, thermally conductive and EMI shielding solutions from Dow
Don Horne
Products ippt Motors Temperature Valves
Dow Performance Silicones will showcase a wide range of new and recently introduced silicone-based solutions for automotive, communications and consumer electronics applications at CES Asia 2019, June 11 to 13, at the Shanghai New International Expo Center.
Dow’s DOWSIL and SILASTIC solutions for optical bonding, molding, adhesion, heat dissipation and electromagnetic interference (EMI) shielding are key to enable emerging technologies such as 5G networks, electric and autonomous vehicles, and consumer devices for the Internet of Things (IoT).
“The incredibly fast pace of change in connected and smart devices calls for equally rapid advances in materials science,” said Rogier Reinders, global marketing director for Dow Performance Silicones. “Dow’s pipeline of silicone-based products addresses top engineering and regulatory challenges, such as EMI, thermal management and optical performance and zero-defect performance for safety in ADAS displays. Further, these highly tunable materials deliver other valuable properties — enabling one product to solve a range of challenges related to performance, processability and sustainability. Dow is committed to the automotive, communications and consumer electronics industries, as shown by our investment in advanced materials that can play a key role in propelling new technology breakthroughs.”
At CES Asia 2019, Dow will spotlight two optically clear resin (OCR) solutions for automotive displays exposed to harsh environmental conditions. One product being launched at the show is engineered to protect and cushion LCD/OLED display module electrodes. The other, DOWSIL VE-2003 UV Optical Bonding Material, offers improved performance for optical bonding of glass and plastic display covers and touch panels. Both provide high reliability under demanding environmental conditions. A video about these solutions will be shown at the Dow booth during the show.
The company will also feature DOWSIL EC-6601 Electrically Conductive Adhesive, a recently launched, novel silicone adhesive that combines strong EMI shielding capabilities across a wide range of frequencies with durable mechanical properties. DOWSIL EC-6601 Electrically Conductive Adhesive is uniquely formulated to form strong bonds to many substrates and has greater than 150 percent elongation to enable flexibility at the joints. It offers a longer shelf life, better material strength, increased flexibility, stronger adhesion and greater electrical conductivity than competitive conductive elastomers. As an adhesive, it can be used for creating formed-in-place (FIPG) and cured-in-place gaskets (CIPG).
The DOWSIL EC-6601 solution is well suited for use in wearables, such as smartwatches, which are often exposed to significant interference that can disrupt their functionality and accuracy. This new adhesive is part of Dow’s growing portfolio of EMI shielding technologies. At its exhibit, the company will offer a demonstration of the material’s capabilities.
Dow’s booth exhibit at CES Asia 2019 will also focus on several key product innovations that demonstrate the broad scope and high relevance of its portfolio for current challenges facing the automotive, communications and consumer electronics sectors. These range from adhesives for sealing consumer devices and displays to gap fillers that offer excellent thermal conductivity for heat management in electronic powertrain applications. Dow’s SILASTIC 3D-printable silicone rubber, also to be featured at the booth, is formulated specifically for customers seeking to combine the performance benefits of silicone with the design and processing advantages of additive manufacturing.
Another highlight of the Dow exhibit will be a disassembled smartphone showing how various silicone materials can be used for optical bonding, electrode protection, gap filling, gaskets and more – while permitting repairs that extend a device’s useful life to support greater sustainability.
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